Abstract:In order to study heavy metal contamination in the soil of the printed circuit board plant area, soil samples with vertical depth 0~1000cm were collected and the vertical distribution characteristics of heavy metal Cu, Zn, Pb, Cr, Ni, Cd, Hg and As were analyzed. The potential ecological risk and correlation matrix were applied to evaluate the heavy metal contamination degree of soil samples. The results indicated that a certain degree of pollution had been caused in the superficial soil by heavy metals Pb, Zn and As, where the main potential ecological hazards was Pb contamination with a moderate level. Moreover, the concentrations of heavy metals in soils samples decreased significantly with the vertical depth increase. The heavy metals of Pb, Zn, Cr and As were 114.69, 153.17, 55.88, 52.49mg/kg when the depth up to 150cm, which indicated there were heavy metals transformation from surface soil. But the transformation depth was limited without over 200cm. The correlation coefficient of heavy metals demonstrated that there were significant correlations among Pb, Zn, Cr and Cu and As, indicating combined pollution in printed circuit board plant area. The heavy metal contamination in soil were mainly caused by its long-term printed circuit board production.
吴彦瑜, 胡小英, 彭晓春, 洪鸿加. 电路板生产厂区土壤重金属垂向分布特征[J]. 中国环境科学, 2013, 33(增刊): 160-164.
WU Yan-Yu, HU Xiao-Ying, PENG Xiao-Chun, HONG Hong-Jia. Vertical distribution characteristics of heavy metal in printed circuit board plant soil. CHINA ENVIRONMENTAL SCIENCECE, 2013, 33(增刊): 160-164.